News
November 13, 2025
Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM (TM) Series," Its First Successful Formation of 3-layer RDL with CD 1.6 Micrometers on 12-inch Wafer
- Paper Presented at 14th IEEE CPMT Symposium Japan (ICSJ 2025) -
**Taiyo Holdings Steps into the Future of Chip Manufacturing with Advanced Packaging Material**
Taiyo Holdings Co., Ltd., a global leader in electronics materials, has announced the launch of its groundbreaking "FPIM (TM) Series," a next-generation semiconductor-packaging material poised to revolutionize chip manufacturing. The announcement comes hot on the heels of a successful demonstration of the material's capabilities, which involved the formation of a three-layer Redistribution Layer (RDL) with a critical dimension (CD) of just 1.6 micrometers on a large 12-inch wafer. This achievement marks a significant step forward in miniaturization and performance enhancements for semiconductors.
The significance of this breakthrough lies in the increasingly demanding requirements of modern electronics. As devices become smaller and more powerful, the need for advanced packaging solutions that can efficiently connect and protect the delicate silicon chips becomes paramount. The FPIM (TM) Series is designed to meet these challenges, offering improved electrical performance, enhanced thermal management, and increased reliability.
Redistribution Layers (RDLs) are crucial components in semiconductor packaging, acting as pathways that reroute the connections from the chip to the external pins of the package. By achieving a CD of 1.6 micrometers on a three-layer RDL, Taiyo Holdings has demonstrated the potential for creating denser and more complex interconnections, enabling the production of smaller and more powerful chips. The ability to achieve this on a 12-inch wafer, the industry standard size, signifies the material's scalability and commercial viability.
The details of the FPIM (TM) Series and the successful demonstration were shared in a paper presented at the prestigious 14th IEEE CPMT Symposium Japan (ICSJ 2025). This platform allowed Taiyo Holdings to showcase its innovation to the global community of researchers and engineers in the field of component, packaging, and manufacturing technology. The presentation highlighted the material's unique properties and the innovative manufacturing processes used to achieve the impressive results.
The FPIM (TM) Series is expected to have a significant impact on various industries, including mobile devices, high-performance computing, and automotive electronics. By enabling the creation of smaller, faster, and more reliable chips, Taiyo Holdings is contributing to the ongoing evolution of electronic devices and paving the way for future technological advancements. The company anticipates that the new material will be widely adopted by semiconductor manufacturers seeking to push the boundaries of chip performance and miniaturization.
Taiyo Holdings Co., Ltd., a global leader in electronics materials, has announced the launch of its groundbreaking "FPIM (TM) Series," a next-generation semiconductor-packaging material poised to revolutionize chip manufacturing. The announcement comes hot on the heels of a successful demonstration of the material's capabilities, which involved the formation of a three-layer Redistribution Layer (RDL) with a critical dimension (CD) of just 1.6 micrometers on a large 12-inch wafer. This achievement marks a significant step forward in miniaturization and performance enhancements for semiconductors.
The significance of this breakthrough lies in the increasingly demanding requirements of modern electronics. As devices become smaller and more powerful, the need for advanced packaging solutions that can efficiently connect and protect the delicate silicon chips becomes paramount. The FPIM (TM) Series is designed to meet these challenges, offering improved electrical performance, enhanced thermal management, and increased reliability.
Redistribution Layers (RDLs) are crucial components in semiconductor packaging, acting as pathways that reroute the connections from the chip to the external pins of the package. By achieving a CD of 1.6 micrometers on a three-layer RDL, Taiyo Holdings has demonstrated the potential for creating denser and more complex interconnections, enabling the production of smaller and more powerful chips. The ability to achieve this on a 12-inch wafer, the industry standard size, signifies the material's scalability and commercial viability.
The details of the FPIM (TM) Series and the successful demonstration were shared in a paper presented at the prestigious 14th IEEE CPMT Symposium Japan (ICSJ 2025). This platform allowed Taiyo Holdings to showcase its innovation to the global community of researchers and engineers in the field of component, packaging, and manufacturing technology. The presentation highlighted the material's unique properties and the innovative manufacturing processes used to achieve the impressive results.
The FPIM (TM) Series is expected to have a significant impact on various industries, including mobile devices, high-performance computing, and automotive electronics. By enabling the creation of smaller, faster, and more reliable chips, Taiyo Holdings is contributing to the ongoing evolution of electronic devices and paving the way for future technological advancements. The company anticipates that the new material will be widely adopted by semiconductor manufacturers seeking to push the boundaries of chip performance and miniaturization.
Category:
Technology